Partners
Your part, in the design loop
Today a component reaches a designer as a PDF and a part number: specs on page nine, no model to simulate, no way to check it against the rest of the chip. So it gets designed around. A listing here is the opposite of that — the part becomes data a designer can search, simulate and specify in the place they are already designing.
Component & IP vendors
What a listing actually contains
Not a logo on a partner wall. A record a designer can work with: filed by function, carrying the geometry and the ports, and tagged with the band it operates in.
Laser sources
The spec sheet a designer can use
Laser sources get their own record, because the questions a designer asks about a laser are not the questions they ask about a waveguide.
| Field | Why a designer needs it |
|---|---|
| Type and wavelength bands | Which device it is, and where it works — O-band, C-band, or both. |
| Output power and linewidth | The two figures that decide whether a link closes. |
| Modulation bandwidth | Whether it can be modulated directly, or needs an external modulator. |
| Integration method | Submount, bonded, micro-transfer-printed, or grown — because that decides the process. |
| Best for, and suppliers | Where the part wins, and who can supply it. |
| Pros and cons | The honest version, including where it is the wrong choice. |
| Fabricated and characterized | Whether the part exists in silicon and has been measured. |
Including the cons. A listing that only lists advantages is a datasheet, and designers have learned not to trust those. Where a part is the wrong choice, the listing says so.
Measured, not nominal
The curve, not the specification
A part is only as good as the measurement behind it. So the catalogue shows measured spectra with real loss figures, and the platform keeps a measurement library to calibrate against.
| Platform | Measured components |
|---|---|
| SOI 220 nm | MMI 2×2 · bend 90° · crossing · grating coupler · ring resonator |
| SOI 340 nm | MMI 2×2 · bend 90° · crossing · grating coupler · ring resonator |
| SiN 300 nm | MMI 2×2 · bend 90° · crossing · grating coupler · ring resonator |
Test & assembly vendors
Listed by stage, throughput and cost
If you sell test or assembly rather than parts, the same principle applies: a test team should be able to plan capacity around you, not ring you to ask.
| Stage | What happens there |
|---|---|
| Stage 1: Wafer Sort | Known-good-die identification on the photonic and electronic wafer. |
| Stage 2: Integrated E-O | Electro-optic test at the wafer level, where the two domains meet. |
| Stage 3: Optical Engine | Optical engine test, once the dies are assembled into an engine. |
| Stage 4: Module Test | Final module test, at the point the product ships. |
A listing carries your key capability, your throughput in dies per hour, and your cost per hour. Those three figures are what let a test team model the whole chain — and see which stage is the bottleneck before the parts are built rather than after.
Already in the directory
We may already hold a record for your company
Our directory holds thousands of organisations, built from public sources — not from anything you sent us. Find yours, see what we hold, and tell us what is wrong or missing. A person reviews every claim before anything is published.
Calibrated honesty
What we need from a partner, and what we will not do
Get listed
Put your part where the design decisions happen
Send us the part, the process it runs on, and whatever you have measured. We will tell you what the listing would look like — and what is missing to make it useful.