lumiculelight does the math

OSAT

Problem: Yield multiplies across mounts — and bad parts consume packages

Sixteen optical engines at 99% each is 85% system yield. Every untested die bonded is a package wasted.

Three dies, one stack Exploded axonometric of a three-die photonic stack: a carrier board, the driver ASIC drawn as its seven-layer metal stack, the photonic die as the focal part, and the PCSEL light source on top. Carrier boardPCB · POWER + ROUTING Driver ASICEIC · 7-LAYER METAL Photonic diePIC · WAVEGUIDES + GCs PCSELLIGHT SOURCE · ON TOP
Three dies, one stack Exploded axonometric of a three-die photonic stack: a carrier board, the driver ASIC drawn as its seven-layer metal stack, the photonic die as the focal part, and the PCSEL light source on top. Carrier boardPCB · POWER + ROUTING Driver ASICEIC · 7-LAYER METAL Photonic diePIC · WAVEGUIDES + GCs PCSELLIGHT SOURCE · ON TOP
Three dies, one stack: the assembly we design for, and the clearance we check before anything is bonded.