Panels, predictedShift mapped before the mold closescentre ~3 µm · edge ~9 µm cornerrotation judged at the die corner, not the centreAs placed · 7 µm tolpanel yield0.50Mask-bias compensatedpanel yield1.00Best recipe · max 2.7 µmpanel yield1.00Analytic guard-band model (thermal + cure + flow, per-die rotation) — re-run with your EMC, carrier and recipe; measured panels calibrate it.centre ~3 µm · edge ~9 µm at the cornerrotation judged at the die cornerAs placed · 7 µm tol0.50Mask-bias compensated1.00Best recipe · max 2.7 µm1.00Analytic model — re-run with your EMC, carrier and recipe.An 8×8 panel three ways: 0.50 at 7 µm tolerance, 1.00 mask-bias compensated, 1.00 at 2.7 µm max — rotation judged at the die corner. SwipeSwipe the figure to read it — tap for the full view81-combo recipe sweep in milliseconds: EMC, carrier, mold temperature, copper density.Measured panels calibrate it — scale, offset and residual against your AOI data.Lumicule