lumiculelight does the math

Next step

Send us your package

Give us one package problem you solve by hand today; we will run it through the geometry checks live.

What to send

  • The stack — die sizes, bump map, interposer, FAU, lid and cold-plate geometry or STEP
  • The panel — panel size, die pitch, EMC and carrier, mold temperature, RDL tolerance
  • The clearance or thermal check you do by hand today
  • Volumes and test requirements — KGD criteria, burn-in, target assembly date
  • The failure you paid for most recently — one bad die, one lost package, one shifted panel

Send it via the contact page →